The Buzz Adams Microfabrication Facility Instrumentation

Major Equipment in the Buzz Adams Microfabrication Facility

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Photolithography Equipment
	ABM UV Flood and Mask Alignment System The i-line near-UV flood source produces light with an intensity of 21 mW/cm2, with wavelengths below 350 nm being filtered out. Automatic exposure timing down to 0.1 s, stage adjustments (x, y, z, and Θ) with 1 μm precision.
	Brewer CEE100 Programmable Spin Coater & Thermolyne PMC Digital Hot Plate The spin coater has ten programmable presets, each with timed and stepped control of acceleration rates (1-30000 r/m/s) and held angular speeds (1-6000 r/m), with repeatability of ±5 r/m. The microprocessor controlled PMC hot plate holds timed and stepped temperatures from 38 to 370° C (± 2° C).
	Diagnostic and Circuit-testing Microscopes One of three inspection microscopes in our facility, this Zeiss microscope features 5x, 10x, 20x, 50x and 100x objective lenses, and dark and bright field illumination. An attached camera enables video and still image capturing.
	Diagnostic and Circuit-testing Microscopes One of three inspection microscopes in our facility, this Zeiss microscope features 5x, 10x, 20x, 50x and 100x objective lenses, and dark and bright field illumination. An attached camera enables video and still image capturing.
Plasma Etching
	Oxford Plamalab System 100 This instrument is used for plasma etching of high surface ratio features
	Hydroflouric Acid Etching Station Set in a dedicated fume hood with a deep basin, this etching station is used to wet etch glass microfluidic devices using a buffered oxide etch process.
Film Deposition
	Lesker thin film deposition system This instrument deposits films—primarily metals— using one of two DC magnetron sputtering sources in a low temperature environment. An Inficon quartz crystal monitors deposition rate and thickness.
	Oxford Plasmalab 80 Plus PECVD The new plasma-enhanced deposition system uses NH3, N2O, N2, CF4, and SiH4/O2 to deposit siliconbased, nitride and oxide films on various substrates for superconductor fabrication at low temperatures.
Semiconductor Characterization
	HORIBA Jovin Yvon UVISEL - Spectroscopic Ellipsometer The UVISEL ellipsometer measures features down to 250 nm, with a spectral range from 250 to 2100 nm—ideal for measuring semiconductor features and thin film deposition.
Evaluation
	Tencor Alphastep 200 Profilometer The Alphastep profilometer is used to measure features down to low micrometer heights, with scan lengths from 80 to 10000 microns, and resolution down to 5 nanometers.
Miscellaneous
	Fisher Programmable Muffle Furnace Used primarily for glass bonding, this furnace allows for timed and stepped control of temperatures from ambient to 1125° C.
	Labconco Vertical Clean Bench This work station is used for mixing and degassing substrate monomers, such as PDMS, prior to molding and curing. Air handling provides an ISO Class 5 (US FED Class 100) work environment.
Microchip Machine Shop
	Universal CO2 Laser Engraving System In addition to myriad other uses, this equipment is used to ablate microchannels in polymer plastics (such as PDMS and PMMA) and glass, with feature sizes down to ~100 μm across.
	Carver heatable lab press